O le faʻatasiga o se gaioiga autu i le gaosiga o le 'apamemea o' apamemea. E avea o se "ata talie o le" Molecular-tulaga "i luga, faʻalauteleina le afaina o le afaina aʻo faatafunaina o lona aʻafiaga i meatotino taua, pei o le faʻamalosiʻau ma faʻatauga. This article delves into the science behind ...
E fesoʻotaʻi mea faʻavae taua i nei faalenatura faʻalona ma faiga eletise, faʻamautinoaina faʻatuatuaina fesoʻotaʻiga, eletise, ma faʻailoga faʻailoga. With the growing demand for higher performance and miniaturization, connectors are increasingly critical acros...
Faʻatafa o 'apamemea o se vaega autu o le aufaasālaiga o le aufaasālalau laufanua This article analyzes the mechanism by which degreasing treatment optimizes the per...
O fesoʻotaʻiga o loʻo taua i masini ma masini eletise, faʻamaonia o lelei fesoʻotaʻiga mo le eletise, saini fesiitai. With increasing demands for high performance and compact designs in electronics, material selection for terminal connectors...
Copper-faʻavae ua lelei le vevela vevela o le maualuga-faʻatinoga o le sili ona lelei vaega o loʻo fuafuaina mo le faʻamalieina vevela i masini eletise ma eletise eletise. Ma le tulaga ese ai le faiga o le fale gaosi faʻatautaia, ma faʻagaioia fetuʻutuʻunaʻi, latou te faʻaaogaina lautele, mai le au faʻatau ...
IGBT (Faʻalauiloa Gate Bipot Transistor) o se vaega autu o le mana faaeletonika o taʻavale fou o taʻavale fou As a highly efficient semiconductor device, IGBT plays a critical role in vehicle efficiency and reliability. CIVEN METAL&#...
Taʻitaʻi faʻavaʻa o mea e sili ona taua i totonu o le faʻa-electronics alamanuia. E faʻaaogaina lautele i le semponductor afifi, faʻafesoʻotaʻi Chips i fafo atu o aitalafu ma faʻamautinoaina le mautu ma faʻatuatuaina o masini eletise. Mai i le telefoni ma le fale faigaluega i le auala i le otometi eletise ...
O le faʻapopoleina o le eletise, o se mea taua o loʻo faʻaalia e le sili ona malosi, lamatia o lamatiaga, ma le maualuga o le tulaga maualuga. Ua maua ai ni faʻamatalaga lautele i le lithibum-ion maa, masini eletise, hydrogeen futu sela, ma le aerospace, tautua o se faʻavae o technolo ...
I le tele o talosaga faaonapo nei, suamalie fesoʻotaʻiga mea taua mo le ausiaina o fetuʻutuʻunaʻi, faʻatuatuaina, ma le onosaʻi i fesoʻotaʻiga eletise. Copper foil has emerged as the material of choice for flexible connections due to its excellent conductivity, malleability, and strength. CIVEN ME...
I le aso nei o loʻo i ai nei, o mea faigaluega a potu, o le filifilia o loʻo afaina ai ona faʻauiga le lelei o le faʻatulagaina o le tulaga ma le poto masani a le tagata. Apamemea apamemea, ma lona amio maualuga ma mautu leo leo faʻasalalauga, ua avea ma mea e sili ona filifilia mo leo masini ma eng ...
From November 12th to 15th, CIVEN METAL will participate in Electronica 2024 in Munich, Germany. Our booth will be located at Hall C6, Booth 221/9. I le avea ai ma se tasi o le lalolagi faʻalauiloa sili atu o fefaʻatauaiga o le au eletise, e tosina mai ai le eletise
I le faʻaopopoga i ana faʻaaogaina nei i tagata i lalo o le eletise, o Copper e maua ai isi aʻoaʻoga i le lumanaʻi ma le au uo faʻaagaga. Here are some potential future uses and developments: 1. Solid-State Batteries Current Collectors and Conductive Networks...
I le lumanaʻi 5G mea faigaluega, o le talosaga o le apamemea o le a faʻalauteleina atili, muamua i nofoaga nei: 1. Maualuga le saoasaoa CRABR)
Ua taua tele le apaau i le CAPPACKCACKCEDO ona o lana eletise eletise, ma faʻatautaia o susu, ma le tau-lelei. Here is a detailed analysis of its specific applications in chip packaging: 1. Copper Wire Bonding Replacement for Gold or Aluminum W...
I. Vaʻai lautele o le POST-Pulea apamemea Flep Comen-Pulea Pipper o loʻo faʻasino i le 'apamemea i luga o le' auʻaiga This type of copper foil is widely used in electronics, electrical, communicati...
O le malosi taua tele ma faʻaigoa o apamemea pepa e lua taua mea totino, ma e i ai se soʻotaga i le va o latou, e aʻafia ai le lelei o le apamemea ma le faʻatuatuaina o le apamemea. Tensile strength refers to the ability of copper foil to resist tensile fract...
The annealing process of copper foil is an important step in the production of copper foil. E aofia ai le tauaveina o le 'apamemea i se vevela e pei o se tau vevela, uu i se vaitaimi, ona faʻamamaina lea ia ia alualu i luma le faʻavaega o le' apamemea. The main purpose of annealing ...
I. Vaaigafagavii ma atinaʻe talaʻaga o le 'apamemea cpercle clad hemitate (FCCL) fetuʻutuʻu o le apamemea (FCCL) o se mea lelei e ala i le feololo. FCCL was first introduced in the 1960s, initially used primarily ...