< img maualuga = "1" lautele = "1" style = "faʻaali: leai se" src = "https://www.facebook.com/tr?id=1663378561090394&ev=PageView&noscript=1" /> Lelei sili ona lelei Saina OEM gaosi oloa Electromagnetic Shielding ED Copper Foil Manufacturer and Factory | Civen

Lelei lelei Saina OEM Manufacturer Electromagnetic Shielding ED Copper Foil

Fa'amatalaga Puupuu:

Electrolytic copper foil mo FPC ua fa'apitoa ona atia'e ma gaosia mo le FPC alamanuia (FCCL). O lenei pepa apamemea electrolytic e sili atu le ductility, maualalo roughness ma sili atu le malosi pa'u nai lo isi pepa apamemea.


Fa'amatalaga Oloa

Faailoga o oloa

O la matou kamupani talu mai lona amataga, e masani lava ona manatu i le oloa maualuga e pei o le olaga o le kamupani, faʻamalosia pea le gaosiga o tekonolosi, faʻaleleia le lelei o oloa ma faʻaauau pea ona faʻamalosia le pulega sili ona lelei a le kamupani, e tusa ai ma le faʻaaogaina o le ISO 9001: 2000 mo le lelei o Saina OEM Manufacturer Electromagnetic Puipuia ED Copper Foil, Matou te faʻamoemoe faʻamaoni e faʻatuina ni mafutaga faʻamalieina faʻatasi ma oe mai le latalata i le umi. O le a matou fa'asaoina oe e logoina lo matou alualu i luma ma nofo i luga mo le fausiaina o sootaga fa'ale-aganu'u fa'atasi ma oe.
O la matou kamupani talu mai lona amataga, e masani ona manatu i le oloa maualuga e pei o le olaga o le kamupani, faʻateleina le gaosiga o tekonolosi, faʻaleleia le lelei o oloa ma faʻaauau pea ona faʻamalosia le pulega sili ona lelei a le kamupani, e tusa ai ma le faʻaaogaina o le ISO 9001: 2000 mo le atunuʻu.Saina Copper Foil, Tape apamemea, Ia mautinoa e te lagona le leai o se totogi e lafo mai ia i matou au faʻamatalaga ma o le a matou tali atu mo oe i se taimi vave. O lo'o iai la matou 'au fa'ainisinia fa'apitoa e tautua mo manaoga fa'apitoa ta'itasi. E mafai ona lafo fa'ata'ita'i fua mo oe lava ia e iloa atili ai mea moni. Ina ia mafai ona e ausia ou manaʻoga, e tatau ona e matua lagona le leai o se totogi e faʻafesoʻotaʻi ai i matou. E mafai ona e lafo mai imeli ma vala'au sa'o mai. E le gata i lea, matou te faʻafeiloaʻi asiasiga i la matou fale gaosi oloa mai le lalolagi atoa mo le sili atu ona iloa lelei o la matou kamupani. nd oloa. I la matou fefaʻatauaʻiga ma tagata faʻatau o le tele o atunuʻu, e masani ona matou tausisi i le mataupu faavae o le tutusa ma le manuia. O lo matou faʻamoemoe e maketi, e ala i taumafaiga faʻatasi, fefaʻatauaʻiga ma faauoga mo lo tatou manuia. Matou te tulimatai atu i le mauaina o au fesili.

Folasaga o oloa

Electrolytic copper foil mo FPC ua fa'apitoa ona atia'e ma gaosia mo le FPC alamanuia (FCCL). O lenei pepa apamemea electrolytic e sili atu le ductility, maualalo roughness ma sili atu le malosi pa'u nai lo isi pepa apamemea. I le taimi lava e tasi, o le faʻamaeʻaina o luga ma le faʻalelei o le pepa apamemea e sili atu ma o le gaugau o le teteʻe e sili atu foi nai lo mea faapena. Talu ai o lenei pepa apamemea e faʻavae i luga o le electrolytic process, e le o iai le gaʻo, lea e faigofie ai ona tuʻufaʻatasia ma mea TPI i le maualuga o le vevela.

Fuafuaga

Mafiafia: 9µm~35µm

Fa'atinoga

O le pito i luga o le oloa e uliuli pe mumu, e maualalo le roughness luga.

Talosaga

Lamina Fa'aofuofu Fa'a'ofu Fe'ai (FCCL), Fine Circuit FPC, fa'apupulaina tioata manifinifi ata tifaga.

Vaega

High density, maualuga le punou tetee ma lelei etching faatinoga.

Microstructure

1

SEM(A'o le'i Togafitiga Laupapa)

2

SEM(Iila iila ina ua uma Togafitiga)

3

SEM(Itu Saua pe a uma Togafitiga)

Laulau1- Fa'atinoga (GB/T5230-2000, IPC-4562-2000)

Fa'avasegaga

Vaega

9μm

12μm

18μm

35μm

Cu Anotusi

%

≥99.8

Fuafuaga o le Eria

g/m2

80±3

107±3

153±5

283±7

Malosi Tetele

RT(23℃)

Kg/mm2

≥28

HT(180℃)

≥15

≥15

≥15

≥18

Fa'aumiumi

RT(23℃)

%

≥5.0

≥5.0

≥6.0

≥10

HT(180℃)

≥6.0

≥6.0

≥8.0

≥8.0

Talatala

Iila(Ra)

μm

≤0.43

Mata(Rz)

≤2.5

Peel Malosi

RT(23℃)

Kg/cm

≥0.77

≥0.8

≥0.8

≥0.8

Fa'aleagaina fua ole HCΦ(18%-1hr/25℃)

%

≤7.0

Suiga o lanu(E-1.0hr/200℃)

%

Lelei

Solder Opeopea 290℃

Sec.

≥20

Fa'aaliga (Spot and Copper powder)

—-

Leai

Pua fa'amau

EA

O

Tele Fa'apalepale

Lautele

mm

0~2mm

Umi

mm

—-

Autu

Mm/inisi

I totonu Diamita 79mm/3 inisi

Fa'aaliga:1. Copper foil oxidation resistance performance and surface density index e mafai ona feutagai.

2. O le faʻasologa o faʻatinoga e faʻatatau i la tatou metotia suʻega.

3. O le taimi faʻamaonia lelei o le 90 aso mai le aso na maua ai.

O la matou kamupani talu mai lona amataga, e masani lava ona manatu i le oloa maualuga e pei o le olaga o le kamupani, faʻamalosia pea le gaosiga o tekonolosi, faʻaleleia le lelei o oloa ma faʻaauau pea ona faʻamalosia le pulega sili ona lelei a le kamupani, e tusa ai ma le faʻaaogaina o le ISO 9001: 2000 mo le lelei o Saina OEM Manufacturer Electromagnetic Puipuia ED Copper Foil, Matou te faʻamoemoe faʻamaoni e faʻatuina ni mafutaga faʻamalieina faʻatasi ma oe mai le latalata i le umi. O le a matou fa'asaoina oe e logoina lo matou alualu i luma ma nofo i luga mo le fausiaina o sootaga fa'ale-aganu'u fa'atasi ma oe.
Lelei leleiSaina Copper Foil, Tape apamemea, Ia mautinoa e te lagona le leai o se totogi e lafo mai ia i matou au faʻamatalaga ma o le a matou tali atu mo oe i se taimi vave. O lo'o iai la matou 'au fa'ainisinia fa'apitoa e tautua mo manaoga fa'apitoa ta'itasi. E mafai ona lafo fa'ata'ita'i fua mo oe lava ia e iloa atili ai mea moni. Ina ia mafai ona e ausia ou manaʻoga, e tatau ona e matua lagona le leai o se totogi e faʻafesoʻotaʻi ai i matou. E mafai ona e lafo mai imeli ma vala'au sa'o mai. E le gata i lea, matou te faʻafeiloaʻi asiasiga i la matou fale gaosi oloa mai le lalolagi atoa mo le sili atu ona iloa lelei o la matou kamupani. nd oloa. I la matou fefaʻatauaʻiga ma tagata faʻatau o le tele o atunuʻu, e masani ona matou tausisi i le mataupu faavae o le tutusa ma le manuia. O lo matou faʻamoemoe e maketi, e ala i taumafaiga faʻatasi, fefaʻatauaʻiga ma faauoga mo lo tatou manuia. Matou te tulimatai atu i le mauaina o au fesili.


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