I le fanua opepa apamemeagaosiga, roughening post-togafitiga o le faagasologa autu mo le tatalaina o le mea o le malosi sootaga sootaga. O lenei tusiga o loʻo auʻiliʻili ai le manaʻomia o le faʻamaʻaina o togafitiga mai ni vaaiga se tolu: faʻaogaina o le taula faʻainisinia, auala faʻatinoina o gaioiga, ma le faʻaogaina o le faʻaogaina. O lo'o su'esu'eina fo'i le aoga o le fa'aogaina o lenei tekonolosi i matā'upu e pei o feso'ota'iga 5G ma ma'a malosi fou, fa'avae i luga.Uamea CIVENfa'alavelave fa'atekinisi.
1. Togafitiga Fa'asa'a: Mai le "Malei Smooth" i le "Faiga Fa'amau"
1.1 Le Fa'aletonu Mata'utia o le Lau'ele'ele
O le talatala muamua (Ra) opepa apamemealuga e masani ona itiiti ifo i le 0.3μm, lea e tau atu i mataupu nei ona o ona uiga fa'ata:
- Le lava Feso'ota'iga Faaletino: O le nofoaga faʻafesoʻotaʻi ma resin e naʻo le 60-70% o le tau faʻavae.
- Papuipui Fa'apipi'i vaila'au: O se vaega mafiafia o le oxide (Cu₂O mafiafia e uiga i le 3-5nm) e fa'alavelaveina ai le fa'aalia o vaega fa'agaoioia.
- Ma'ale'ale Fa'avevela: Eseesega i le CTE (Coefficient of Thermal Expansion) e mafai ona mafua ai le faʻaogaina o fesoʻotaʻiga (ΔCTE = 12ppm / ° C).
1.2 E Tolu Tulaga Fa'apitoa Fa'ainisinia i Fa'agasologa Fa'asa'o
| Fa'asologa Fa'asologa | I'ila apamemea masani | I'ila 'apa 'apamemea | Fa'aleleia |
| Lau'ele'ele Ra (μm) | 0.1-0.3 | 0.8-2.0 | 700-900% |
| Avanoa Fa'apitoa (m²/g) | 0.05-0.08 | 0.15-0.25 | 200-300% |
| Malosi Pa'u (N/cm) | 0.5-0.7 | 1.2-1.8 | 140-257% |
E ala i le faia o se micron-level tolu-dimensional fausaga (silasila i le Ata 1), o le vaega talatala ausia:
- Fesoota'iga Fa'ainisinia: Resin penetration forms "barbed" taula (loloto> 5μm).
- Fa'atosinaina o kemikolo: Fa'aalia (111) va'alele tioata maualuga e fa'ateleina ai le tele o nofoaga fa'apipi'i ile 10⁵ nofoaga/μm².
- Fa'asa'o Fa'ainitaneti: O le fausaga porous e mitiia le sili atu i le 60% o le vevela vevela.
- Fa'agasolo Auala: Fofo fa'apipi'i apamemea acidic (CuSO₄ 80g/L, H₂SO₄ 100g/L) + Pulse Electro-deposition (taamilosaga tiute 30%, taimi 100Hz)
- Vaega Fa'avae:
- Kopa dendrite maualuga 1.2-1.8μm, lautele 0.5-1.2μm.
- Fa'asagaga o le okesene i luga ole ≤200ppm (XPS su'esu'ega).
- Fa'afeso'ota'i tetee <0.8mΩ·cm².
- Fa'agasolo Auala: Fofo fa'apipi'i u'amea kobalt-nickel (Co²+ 15g/L, Ni²+ 10g/L) + Fa'asagaga Fa'ama'i (pH 2.5-3.0)
- Vaega Fa'avae:
- 0.3-0.8μm, fa'apipi'i tele > 8×10⁴ fasimea/mm².
- Fa'asagaga o le okesene ≤150ppm.
- Fa'afeso'ota'i tetee <0.5mΩ·cm².
2. Red Oxidation vs. Black Oxidation: Le Fa'agasologa o Mea lilo i tua o Lanu
2.1 Oxidation Mumu: O le “Otau” a le Kopa
2.2 Oxidation Uliuli: O le Alloy "Otau"
2.3 Fa'atauga Fa'atauga I tua o Filifiliga Lanu
E ui lava o faʻataʻitaʻiga autu o faʻatinoga (adhesion ma conductivity) o le mumu ma le uliuli oxidation e ese mai i lalo ifo o le 10%, o loʻo faʻaalia e le maketi se eseesega manino:
- I'ila apamemea mūmū fa'ama'i: Fa'amatalaga mo le 60% o sea maketi ona o lona tau taua tele (12 CNY/m² vs. uliuli 18 CNY/m²).
- Pepa Kopa Fa'ama'i Fa'ama'i uliuli: Pulea le maketi maualuga (FPC faʻapipiʻi taavale, millimeter-galu PCBs) ma le 75% sea maketi ona o:
- 15% faʻaitiitiga i le maualuga o le gau (Df = 0.008 vs. red oxidation 0.0095 i le 10GHz).
- 30% faʻaleleia le CAF (Conductive Anodic Filament) teteʻe.
3. Uamea CIVEN: “Nano-Level Masters” o Tekinolosi Fa'a'oa'oa
3.1 Fa'atekonolosi fou "Gradient Roughening".
E ala i le faʻatonutonuina o faʻagasologa e tolu,Uamea CIVENfa'alelei le fausaga o luga (silasila i le Ata 2):
- Nano-Crystalline Fua Fa'avae: Electro-deposition o 'apa kopa 5-10nm i le lapopoa, density > 1×10¹¹ particles/cm².
- Micron Dendrite Tuputupu ae: O le pa'u o lo'o i ai nei e pulea le fa'atonuga o le dendrite (fa'amuamua le itu (110)).
- Fa'asalaina i luga: Fa'apipi'i so'o so'o (APTES) fa'apipi'i fa'aleleia le fa'ama'iina.
3.2 Fa'atinoga e Sili atu i Tulaga Fa'atino
| Mea Su'ega | IPC-4562 tulaga masani | Uamea CIVENFua Fa'amaumauga | Fa'amanuiaga |
| Malosi Pa'u (N/cm) | ≥0.8 | 1.5-1.8 | + 87-125% |
| Lau'ele'ele Taua CV | ≤15% | ≤8% | -47% |
| Pa'u Pa'u (mg/m²) | ≤0.5 | ≤0.1 | -80% |
| Susū Tetee (h) | 96 (85°C/85%RH) | 240 | +150% |
3.3 Fa'ai'uga Fa'aoga Fa'aoga Fa'asologa
- 5G Base Station PCB: Fa'aaoga le pepa apamemea oxidized uliuli (Ra = 1.5μm) e ausia <0.15dB/cm fa'aofi gau i le 28GHz.
- E aoina maa malosi: Mumu fa'ama'iinapepa apamemea(malosi tensile 380MPa) maua ai le ta'amilosaga ola > 2000 ta'amilosaga (tulaga fa'ale-atunu'u 1500 ta'amilosaga).
- Aerospace FPCs: O le lapisi talatala e tetee atu i le te'i vevela mai le -196°C i le +200°C mo le 100 taamilosaga e aunoa ma se delamination.
4. Le Malae Taua i le Lumana'i mo I'ila 'apa 'apamemea
4.1 Tekinolosi Ultra-Roughening
Mo 6G terahertz fesoʻotaʻiga manaʻoga, o se fausaga faʻapipiʻi ma Ra = 3-5μm o loʻo atiaʻe:
- Dielectric tumau mautu: Fa'aleleia ile ΔDk <0.01 (1-100GHz).
- Tete'e vevela: Fa'aitiitia i le 40% (ausia le 15W/m·K).
4.2 Faiga Fa'amamago Atamai
Tu'ufa'atasiga su'esu'ega va'ai AI + fa'agasologa o suiga fa'agasolo:
- Mata'itū i luga ole taimi moni: Fa'ata'ita'iga taimi 100 fa'avaa ile sekone.
- Fetuuna'i le Density o le taimi nei: Sa'o ±0.5A/dm².
O le fa'amalo o le pepa apamemea ina ua mae'a togafitiga ua alia'e mai se "faiga e filifili ai" i se "fa'ateleina fa'atinoga." E ala i le faʻagasologa o mea fou ma le pulea lelei tele,Uamea CIVENua tuleia faatekonolosi roughening i atomic-tulaga saʻo, saunia lagolago mea faavae mo le faaleleia o alamanuia faaeletonika. I le lumanaʻi, i le tausinioga mo tekinolosi sili atu le atamai, maualuga atu, ma sili atu ona faʻatuatuaina, poʻo ai lava na te faʻaaogaina le "micro-level code" o tekinolosi faʻamalosi o le a pulea le tulaga maualuga maualuga o lepepa apamemeaalamanuia.
(Fa'amatalaga Punaoa:Uamea CIVEN2023 Lipoti Fa'atekinisi Faaletausaga, IPC-4562A-2020, IEC 61249-2-21)
Taimi meli: Apr-01-2025