ED Copper Foils mo FPC

Fa'amatalaga Puupuu:

FCF, fetuutuunaipepa apamemea e fa'apitoa ona atia'e ma gaosia mo le FPC alamanuia (FCCL).O lenei pepa apamemea electrolytic e sili atu ductility, roughness maualalo ma sili atu le malosi pa'u nai loisi pepa apamemeas.I le taimi lava e tasi, o le pito i luga ma le faʻalelei o le pepa apamemea e sili atu ma o le gaugau teteʻefoie sili atu nai lo mea fa'apena pepa apamemea tutusa.Talu ai o lenei pepa apamemea e faʻavae i luga o le electrolytic process, e le o iai le gaʻo, lea e faigofie ai ona tuʻufaʻatasia ma mea TPI i le maualuga o le vevela.


Fa'amatalaga Oloa

Faailoga o oloa

Folasaga o oloa

FCF, fetuutuunaipepa apamemea e fa'apitoa ona atia'e ma gaosia mo le FPC alamanuia (FCCL).O lenei pepa apamemea electrolytic e sili atu ductility, roughness maualalo ma sili atu le malosi pa'u nai loisi pepa apamemeas.I le taimi lava e tasi, o le pito i luga ma le faʻalelei o le pepa apamemea e sili atu ma o le gaugau teteʻefoie sili atu nai lo mea fa'apena pepa apamemea tutusa.Talu ai o lenei pepa apamemea e faʻavae i luga o le electrolytic process, e le o iai le gaʻo, lea e faigofie ai ona tuʻufaʻatasia ma mea TPI i le maualuga o le vevela.

Fuafuaga:

Mafiafia:9µm35µm

Fa'atinoga

O le pito i luga o le oloa e uliuli pe mumu, e maualalo le roughness luga.

Talosaga

Laminate Fa'aofuofu Fa'a'ofu Fe'ai (FCCL), FPC Fine Circuit, ata tioata manifinifi tioata fa'apipi'iina.

Vaega:

High density, maualuga le punou tetee ma lelei etching faatinoga.

Microstructure:

ED Copper Foils mo FPC3

SEM(Itu Saua pe a uma Togafitiga)

ED Copper Foils mo FPC2

SEM(A'o le'i Togafitiga Laupapa)

ED Copper Foils mo FPC1

SEM(Iila iila ina ua uma Togafitiga)

Siata 1- Fa'atinoga (GB/T5230-2000, IPC-4562-2000):

Fa'avasegaga

Vaega

9μm

12μm

18μm

35μm

Cu Anotusi

%

≥99.8

Fuafuaga o le Eria

g/m2

80±3

107±3

153±5

283±7

Malosi Tetele

RT(23℃)

Kg/mm2

≥28

HT(180℃)

≥15

≥15

≥15

≥18

Fa'aumiumi

RT(23℃)

%

≥5.0

≥5.0

≥6.0

≥10

HT(180℃)

≥6.0

≥6.0

≥8.0

≥8.0

Talatala

Iila(Ra)

μm

≤0.43

Mata(Rz)

≤2.5

Peel Malosi

RT(23℃)

Kg/cm

≥0.77

≥0.8

≥0.8

≥0.8

Fa'aleagaina fua ole HCΦ(18%-1hr/25℃)

%

≤7.0

Suiga o lanu(E-1.0hr/200℃)

%

Lelei

Solder Opeopea 290℃

Sec.

≥20

Fa'aaliga (Spot and Copper powder)

----

Leai

Pua fa'amau

EA

O

Tele Fa'apalepale

Lautele

mm

0~2mm

Umi

mm

----

Autu

Mm/inisi

I totonu Diamita 79mm/3 inisi

Manatua: 1. Copper foil oxidation resistance performance and surface density index e mafai ona feutagai.

2. O le faʻasologa o faʻatinoga e faʻatatau i la tatou metotia suʻega.

3. O le taimi faʻamaonia lelei o le 90 aso mai le aso na maua ai.


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