Oloa
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![[HTE] maualuga le elongation ed conpper](https://cdn.globalso.com/civen-inc/HTE-High-Elongation-ED-Copper-Foil.png)
[HTE] maualuga le elongation ed conpper
Cliven uamea
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Cliven uamea specifically for the lithium battery manufacturing industry. O lenei electrolytic apamemea o loʻo i ai le lelei o le maualuga o le amio mama, maualalo le maualalo, lelei luga, mafolafola luga, toniga feteʻenaʻiga, ma faigofie feeseeseaiga. Ma le maualuga le mama ma sili le hydrohilic, o le electrolyic apamemea mo maa e mafai ona faʻateleina ai le tele o le tau ma le faʻatamaʻi o le ola o maa. I le taim lava lena,Cliven uamea
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Cliven uamea roughness and high peel strength. O le apamemea mo le mafai ona gaosia e le electrolysis gaioiga e iai le lelei o le maualuga maualuga, maualalo maualalo, lamolemole luga, mafolafola foliga, ma lautele. The electrolytic copper foil can be better laminated with other materials after roughening on one side, and it is not easy to peel off.
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electrolytic copper foil is a copper foil that has been roughened to varying degrees on both sides. O lenei mea e faʻamalosia ai le malu malosi o itu faʻatatau uma a le apamemea, ma faʻafaigofie ai ona faʻaaoga o se vaega tuʻufaʻatasia mo isi mea. Moreover, the different levels of treatment on both sides of the copper foil make it easier to etch the thinner side of the roughened layer. In the process of making a printed circuit board (PCB) panel, the treated side of the copper is applied to the dielectric material. The treated drum side is rougher than the other side, which constitutes a greater adhesion to the dielectric. This is the main advantage over standard electrolytic copper. The matte side does not require any mechanical or chemical treatment prior to the application of photoresist. It is already rough enough to have good laminating resist adhesion.
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apamemea apamemea isi apamemea apamemeas. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance isbetter than similar copper foil products. Talu ai o lenei pepa palota e faʻavae i luga o le eletise eletise, e le o le gaʻo, lea e faʻafaigofie ai le tuʻufaʻatasia ma le TPI mea i le vevela.
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Puipuiga ed copper copper
Cliven uamea not only has good electrical conductivity because of the high purity of copper, but also is easy to etch and can effectively shield electromagnetic signals and microwave interference. The electrolytic production process allows for a maximum width of 1.2 meters or more, allowing for flexible applications in a wide range of fields. The copper foil itself has a very flat shape and can be perfectly molded to other materials. E teteʻe foi le 'apamemea i le maualuga-vevela o le tau ole tau o le tautaliga ma le' malulu, faia ia talafeagai mo le faʻaaogaina i siosiomaga tau siosiomaga poʻo oloa ma mea e manaʻomia ai manaʻoga o le olaga.
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Maualuga-saʻo le rume apamemea
Maualuga-o le le-sili atu o apamemea ma zinc eling forlil o se tasi o le fao e fausia eCliven uamea tatou production facilities. Lea O le pepa lautele e sili atu le saʻo, sili atu le lelei o le laualuga, ma sili atu luga o le lelei e le masani ai
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Togafitia le cper copper
Taulimaina le Rapper Copper o se tasi itu o le tasi itu o le copper compper compess ina ia mafai ai ona faateleina lona malosi. O le papaʻe o le apamemea e fiafia e fiafia ai i se gaʻo gaʻo, e faʻafaigofie ai ona faʻafefeteina ma isi mea ma e ono paʻu ese.
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O le Skikel Soure e maualuga le mautu i le ea, malosi le mafai ona faia se ata manifinifi tele i le ea, e mafai ona maua le vaifofo, e le faigofie le va o le 600℃; nickel plating layer has strong adhesion, not easy to fall off; Nickel Plating Syster mafai ona faia le laʻei o mea faigata, mafai ona faʻaleleia le oloa o loʻo ofuina le saʻo ma Abid ma Alkali Rearocity o gaioiga o le sili ona lelei.
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