[VLP] Fa'ailoga Maulalo ED Copper Foil
![[VLP] Fa'ailoga Maulalo ED Copper Foil Ata Fa'aalia](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil.png)
Folasaga o oloa
VLP, pa'u kopa pa'u eletise maualalo maualalo na gaosia e le CIVEN METAL o lo'o i ai uiga o le maualalo o le gaogao ma le maualuga o le pa'u malosi. O le pepa apamemea na gaosia e le faiga o le electrolysis o loʻo i ai le lelei o le mama maualuga, maualalo le mama, lamolemole luga, foliga laupapa mafolafola, ma le lautele lautele. O le pepa apamemea electrolytic e mafai ona sili atu ona faʻapipiʻiina ma isi mea pe a uma ona faʻafefe i le tasi itu, ma e le faigofie ona paʻu ese.
Fa'amatalaga
E mafai e le CIVEN ona tu'uina atu le ultra-low profile high temperature ductile electrolytic copper foil (VLP) mai le 1/4oz i le 3oz (nominal mafiafia 9μm i le 105μm), ma le maualuga o le oloa tele o le 1295mm x 1295mm pepa apamemea.
Fa'atinoga
CIVEN e maua ai ultra-mafiafia electrolytic apamemea pepa ma meatotino lelei faaletino o equiaxial tioata lelei, talaaga maualalo, malosi maualuga ma elongation maualuga. (Silasila i le Laulau 1)
Talosaga
Faʻatatau i le gaosiga o laupapa eletise maualuga ma laupapa maualuga mo taavale afi, eletise eletise, fesoʻotaʻiga, militeri ma aerospace.
Uiga
Fa'atusatusa i oloa fa'apenei mai fafo.
1.O le fausaga saito o lo tatou VLP electrolytic apamemea pepa equiaxed lelei tioata tioata; ae o le fausaga o saito o oloa mai fafo faapena e columnar ma umi.
2. Electrolytic apamemea pepa e ultra-maualalalo talaaga, 3oz apamemea pepa i luga ole eleele atoa Rz ≤ 3.5µm; a'o oloa fa'apenei mai fafo o fa'amatalaga masani, 3oz i'a kopa i luga ole la'asaga Rz > 3.5µm.
Tulaga lelei
1. Talu ai o lo tatou oloa o le ultra-maualalo talaaga otooto, e foia ai le tulaga lamatia o le laina laina puupuu ona o le roughness tele o le tulaga mafiafia pepa apamemea ma le faigofie ulu o le pepa insulation manifinifi e le "logo luko" pe a oomi le laupapa itu lua.
2. Aua o le fausaga saito o tatou oloa e equiaxed tioata lelei spherical, e faapuupuuina le taimi o laina etching ma faaleleia le faafitauli o le etching itu laina etching.
3, a o iai le malosi o le paʻu maualuga, leai se paʻu paʻu paʻu paʻu, ata manino PCB gaosiga faʻatinoga.
Fa'atinoga(GB/T5230-2000, IPC-4562-2000)
| Fa'avasegaga | Vaega | 9μm | 12μm | 18μm | 35μm | 70μm | 105μm | |
| Cu Anotusi | % | ≥99.8 | ||||||
| Fuafuaga o le Eria | g/m2 | 80±3 | 107±3 | 153±5 | 283±7 | 585±10 | 875±15 | |
| Malosi Tetele | RT(23℃) | Kg/mm2 | ≥28 | |||||
| HT(180℃) | ≥15 | ≥18 | ≥20 | |||||
| Fa'aumiumi | RT(23℃) | % | ≥5.0 | ≥6.0 | ≥10 | |||
| HT(180℃) | ≥6.0 | ≥8.0 | ||||||
| Talatala | Iila(Ra) | μm | ≤0.43 | |||||
| Mata(Rz) | ≤3.5 | |||||||
| Peel Malosi | RT(23℃) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.9 | ≥1.0 | ≥1.5 | ≥2.0 |
| Fa'aleagaina fua ole HCΦ(18%-1hr/25℃) | % | ≤7.0 | ||||||
| Suiga o lanu(E-1.0hr/200℃) | % | Lelei | ||||||
| Solder Opeopea 290℃ | Sec. | ≥20 | ||||||
| Fa'aaliga (Spot and Copper powder) | ---- | Leai | ||||||
| Pua fa'amau | EA | O | ||||||
| Tele Fa'apalepale | Lautele | mm | 0~2mm | |||||
| Umi | mm | ---- | ||||||
| Autu | Mm/inisi | I totonu ole lautele 79mm/3 inisi | ||||||
Fa'aaliga:1. O le tau o le Rz o le pepa apamemea o le tau mautu o le su'ega, e le o se tau fa'amaonia.
2. Peel malosi o le tulaga masani FR-4 suega laupapa (5 pepa o le 7628PP).
3. taimi fa'amautinoaga lelei e 90 aso mai le aso na maua ai.
![[RTF] Fa'afo'i Fa'ata'ita'iina ED Copper Foil](https://cdn.globalso.com/civen-inc/RTF-Reverse-Treated-ED-Copper-Foil-300x300.png)
![[BCF] Ma'a ED Copper Foil](https://cdn.globalso.com/civen-inc/BCF-Battery-ED-Copper-Foil1-300x300.png)
![[HTE] ED Copper Foil Fa'aumi maualuga](https://cdn.globalso.com/civen-inc/HTE-High-Elongation-ED-Copper-Foil-300x300.png)
